This latest Molex micro connector enables manufacturers of RF antenna modules as well as designers of mobile devices to optimize high-speed 5G components while alleviating space constraints on extremely small yet increasingly crowded printed circuit boards.
“Each new generation of RF antenna modules and smartphones brings us closer to realizing the full potential of 5G performance,” said Stephen Drinan, director of core products, micro solutions, Molex. “Our new 5G25 connector is the latest example of how Molex is applying decades of experience in RF and antenna design, high-speed connectivity and volume manufacturing to support 5G’s higher frequencies while raising the bar in signal stability, robust performance and fast assembly.”
Molex expedited 5G25 development by assembling a global team of RF, antenna, and high-speed communication experts to balance critical electrical, mechanical and environmental requirements. Engineers based in the US and Japan collaborated with a global RF antenna module manufacturer on concept development, advanced simulation and testing, along with rapid design iterations. The use of Molex’s inhouse 5G testing chamber helped the team achieve optimal signal integrity performance to finalize the design concept in two weeks.
According to Molex, it rapidly designed and provided working prototypes within months. As an advisor to a leading smartphone manufacturer, Molex then refined the connector to accommodate the customer’s specific needs while ramping volume manufacturing to produce five million connectors per month. The global collaboration and early customer engagement proved instrumental in accelerating innovative 5G go-to-market strategies.
According to Molex’s recent The Future of Mobile Devices global survey, 82% of those polled believe consumers will see substantial benefits from 5G in their smartphones within five years or sooner. Survey respondents ranked ultra-fast 5G (e.g., mmWave) as the leading technology to drive disruption in smart, consumer mobile device manufacturing. Molex is a leading supplier of advanced 5G RF board-to-board connectors, bolstered by its legacy of innovation and collaboration with leading developers of RF antenna modules and mobile devices.
As a result of extensive testing, the Connector 5G25 series supports high-speed data transmission in a space-saving solution that offers extra protection from harsh environmental conditions. Featuring a signal pitch of 0.35mm, a mated body height of only 0.6mm, as well as a short body width of 2.5mm and length of 3.6mm, the compact size of the 5G25 offers elevated printed wiring board (PWB) design flexibility.
Moreover, the 5G25 enables designers of RF antenna modules and mobile devices to combine RF and non-RF signals, which reduces the need for additional connectors while producing additional space and cost savings.
The 5G25 features full Electromagnetic Interference (EMI) shielding, encompassing both RF terminal and full connector shielding to ensure superior signal integrity. By employing a center shield-in contact with receptacle and plug, each row can be isolated to boost overall signal-integrity stability. Additionally, Molex’s fully-shielded design delivers best-in-class far-field gain performance, which is ideal for connecting 5G antennas to the rest of the transceiver.