According to the agency, Stephen Tisdale has been nominated Chair of IEC Technical Committee 47, which prepares standards for the design, manufacture, use and reuse of discrete semiconductor devices, integrated circuits, display devices, sensors, electronic component assemblies, interface requirements, and microelectromechanical devices.
Tisdale was responsible for more than 35 patents during a 40 year career in the electronics industry, which included a 20 year stint at IBM where the electronics company gave him the designation of Master Inventor for his achievements.
According to IEC, Tisdale has been involved in standardization throughout his career and for the last nine years chaired of one of the TC 47 subcommittees, SC 47, which standardizes the mechanical and thermal aspects of semiconductor packages, package assembly technologies and measuring methods, including wafer level packaging.
In addition to TC 47, he has been a technical expert/interface for IEC TC 91, IEC TC 111 as well as the JEDEC and IPC standards organizations, IEC said.
Tisdale is also a recognized content expert in the areas of environmental compliance, industry standards, semiconductor packaging, printed circuit board (PCB) design / materials and PCB assembly technology. He is also a trusted advisor to the EU regarding semiconductor technologies and RoHS (Restriction of Hazardous Substances) exemptions.
“There have been many exceptional leaders within ANSI and the IEC that were driven by a vision and mission to ensure that critical strategies have been implemented and carried out with other National Committees,” said Tisdale.
“I have been fortunate enough to have been involved in the American Standards Institute (ANSI) and the IEC under the past two leadership terms of TC 47, under Nick Lycoudes and Robert Mitchell, and with this nomination and acceptance of the position of TC 47 Chair, I will do my best to ensure that the tradition of efficient standards development and integrity of the TC is perpetuated.”